The latest version of the world's leading 3D CAD repair & healing software is now available
Paris, Monday, November 4th 2013. ITI TranscenData announced today the release of CADfix 9.0 SP2, the latest edition of its leading CAD interoperability tool which tackles the ever present problems of 3D model data exchange and re-use between different engineering applications. CADfix allows the user to import CAD data, efficiently repair and adapt it, and export in the most suitable form for reuse in the downstream system, eliminating the need for expensive CAD model rework.
Some of the many enhancements in CADfix 9.0 SP2 include:
Enhancements to Import/Export
- New support for NX non-visible layers
- New import of PMI data from STEP and JT
- Improved STL quality facet generation
Assemblies
- Improved assembly tree creation/editing
Defeaturing/Simplification
- Faster hole/protrusion algorithm
Build
- New lofted surface creation tool
- Improved ruled surface creation tool
PMI - 3D Annotation
- New PMI display mode
- New PMI browser on model tree
GUI
- Improved selection tools
- New rotation centre pick via middle mouse button
- New auto-display option when switching working set
The new product release is available immediately worldwide and current CADfix customers can easily upgrade to version 9.0 SP2
About ITI TranscenData
ITI TranscenData is the product data interoperability business within International TechneGroup Incorporated (ITI). ITI TranscenData provides interoperability solutions that enable companies to effectively exchange, reuse, integrate and share engineering product data among diverse software applications used throughout a manufacturing enterprise and its supply chain. ITI TranscenData solutions are aimed directly at reducing and eliminating non-value-added time and costs associated with reusing product data. ITI TranscenData solutions are distributed worldwide through a combination of direct sales, resellers, and strategic vendor/OEM partners. Included among ITI TranscenData's customers are ABB, Airbus, BAE Systems, Boeing, Daimler, EADS, Ford, General Dynamics, Honeywell, Lego, Lockheed Martin, NASA, MAHLE Powertrain, Pratt & Whitney, Raytheon, Renault, Rockwell Collins, Samsung Electronics, Siemens Automotive, Snecma, Spirit AeroSystems, Thales, ThyssenKrupp, US Air Force, US Army, Xerox and others.